MEMS Sensors Packaging

High class and low cost ceramic technology

A thinner, smaller surface mount type leadless package or other customized design structure is available for MEMS which have an open air cavity structure or other specifications.

We offer a variety of packages to meet market demands and full support of high design technology to provide optimized packaging solutions for your requirements.

Features

• 3D design (air cavity type, hermetic sealing availabilities)
• Small hysteresis (superior properties provide less mechanical stress with MEMS)
• No deformation during assembly and use (easy to use and respect the performance of MEMS)
• Wide range for package dimensions (miniaturization)
• Non magnetic solution available

Reference markets