THE NEW VALUE FRONTIER

Componenti per semiconduttori

Modulo di richiesta

Automotive LED Lighting

Higher reliability by ceramic packaging solutions with various kinds of metallization

Basic ceramic technology

Combing the following technology together:

  • Post-fired technology using thin film technology
  • Co-fired technology using multi-layer technology

Features

  • High thermal dissipation
  • High reliability
  • Good dimension tolerance and true position for LED module assembly

Reference applications

  • Head light
  • Daytime running light
  • Turning light
  • Back light

1. Daytime Running Light

AN276 (for CSP)
Co-fired AIN ceramics
Low cost thin film

AO610W
Co-fired alumina with CuW embedded

2. Turning Light

AN276 (for CSP)
Co-fired AIN ceramics
Low cost thin film

3. Head Lamp

Solderless:
AIN 170W or AIN200W
Post-fired ceramics High reliability thin film

Solder type:
AN276 (for CSP)
Co-fired AIN ceramics Low cost thin film

4. Back Light

AN276 (for CSP)
Co-fired AIN ceramics
Low cost thin film

AO610W
Co-fired alumina with CuW embedded